3D non-destructive test services (SAM, X-Ray and LIT)

12 June 2013

PVA TePla Analytical Systems organizes the 4th User Group Meeting at PVA TePla in Westhausen (Germany), on June, Thursday 12-13, 2013. On this event, Mr. Kees Revenberg, Managing Director of MASER Engineering, will give a presentation entitled “3D NDT of IC packages combining X-RAY, SAM and Lock-In Thermography”.

Abstract

The complexity of electronic functions within one package is increasing and challenging the Failure Analysis for yield improvements and field return analysis. System in a Package (SIP) approach results in high density chip placement, wired, flipped or stacked. Also other devices, like passives or ESD protection devices.
The initial fault confirmation starts in most cases with electrical test of the suspected defect device. The next steps require a non-destructive approach. Common practice at MASER Engineering is to expose the samples to 2D/3D X-RAY and Scanning Acoustic Microscopy (SAM) analysis. We have recently acquired the latest DCG systems model ELITE for Lock-In Thermography (LIT).
This paper is about the first results of combining the LIT location with 3D information and the link to detailed SAM and X-RAY analysis. LIT can retrieve Z-axis information about the heat source by top and bottom imaging and phase analysis. This result can guide the X-RAY and SAM analysis. The application range is from power electronic modules to advanced electro-optical stacks of dies in SIP systems.

More information on the 4th ultrasound microscopy user meeting can be found here.

For more information on this presentation and the 3D non-destructive test (NDT) services at MASER Engineering, please contact Mr. Kees Revenberg.

 

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