Additional Re-ball system operational

12 November 2014

MASER Engineering B.V. is pleased to announce that an additional Fineplacer reball station (FINEPLACER® pico ma) from Finetech has been purchased and installed additional to the current reball station. Solderball renewal (reball) is performed after PCB removal and prior to electrical test of the CSP/BGA packages.
The new system is operational since mid 2014 and with the additional capacity installed, MASER Engineering is able to support customers faster in reballing of CSP and BGA packages.

For any further information please contact Mr. Peter de Veen (Physical Analysis Department Manager) or Mr. Mark Gortemaker (Sales Manager).