Hermetic Package qualification test service

26 November 2013

MASER Engineering B.V. is offering complete Hermetic Package Qualification test service according to AEC-Q100 and JESD47 specification standards. Hermetic packages are being used for space application (ceramic packages) or for sensor and MEMS package application where the environment can be contact with the silicon.

  • Temperature Cycling
  • Bond Pull Strength
  • Bond Ball and Die Shear
  • Solderability
  • Solder Ball Shear
  • Mechanical shock
  • Vibration Variable Frequency
  • Constant Acceleration
  • Gross/Fine leak
  • External Visual
  • Physical Dimensions
  • Lead integrity
  • Lid Torque
  • Residual Gas Analysis
  • Tin Whisker Acceptance
  • Package drop

Hermetic Package tests 2013-1 front2.jpg.jpg

Please see also Hermetic Package Qualification Test Service leaflet.

For more information or contact Mr. Wilhelm Niessen (Reliability Department Manager) or Mr. Mark Gortemaker (Sales Manager).