MASER Engineering B.V. participates in ATHENIS 3D project

16 January 2014

We are proud to announce that the European FP7-funded ATHENIS 3D research project has started officially on November 1st, 2013. MASER Engineering B.V., represented by Mr. Kees Revenberg (Managing Director), is participating in this R&D program to work on solutions for tomorrow’s technologies. The project is scheduled to run for 3 years, ending October 2016.

In the ATHENIS 3D project, an acronym for Automotive Tested High Voltage and Embedded Non-Volatile Integrated System on Chip Platform employing 3D integration”, a consortium of 11 partners from Austria, France, Italy, Germany and The Netherlands will work together on developing a new technology platform for automotive electronics. The ATHENIS 3D project will provide the industry’s first 3D integration of advanced More than Moore devices and More Moore devices (90 nm and 14 nm CMOS) with Through Silicon Vias (TSV’s) and Wafer Level Packaging (WLP) for harshest automotive conditions including temperatures up to 200 °C and voltages up to 200 V. Cost savings from integration and a 5x reduction of PCB area will be shown.

Within the ATHENIS 3D project, MASER Engineering will study the reliability aspects of the developed technology, including the accelerated life test setup, ESD handling requirements and package/device failure analysis. The results of this research project will contribute to the prime position of MASER Engineering as an independent engineering support center in Europe.

The consortium consists of a well-balanced mix of 2 large enterprises (ams AG, Valeo Electrical Systems), 4 small-medium enterprises (Crocus Technology, Besi, Active Technologies, MASER Engineering) and 5 public research institutes and universities (Fraunhofer Gesellschaft IISB/IIS, Technische Universität Wien – Institute for Microelectronics, University of Ferrara, University of Pisa, CAE-Leti) from 5 European countries.

More information on the ATHENIS 3D research project can be found on the research section of our website (here) and on the official ATHENIS 3D project website (here).

 ATHENIS 3D logo.jpg

For more information, please contact Mr. Peter de Veen or Mr. Wilhelm Niessen (R&D Managers).