Minister opens hightech Advanced Packaging Centre (APC) in Duiven in The Netherlands

14 January 2010

Minister Maria van der Hoeven of Economic Affairs has opened the Advanced Packaging Centre (APC) on Monday January 11. This was done during a visit of the Minister to Boschman Technologies in Duiven.

The APC is founded by Boschman Technologies, Nedcard, MASER Engineering and Sempro Technologies. The APC is an initiative from the Business Cluster Semiconductors Oost-Nederland. Seventy high tech companies from especially Twente and Nijmegen area are member of the Cluster.

Minister Van der Hoeven: "This kind of initiative from medium sized enterprises The Netherlands needs to get out of the economic crisis”! “A good example of entrepreneurship on a regional level."

The Advanced Packaging Centre (APC) is an independent, technology & development Centre for MEMS, Sensors and advanced IC’s packaging.