New Board Level Reliability drop test system operational

20 March 2015

MASER Engineering B.V. is pleased to announce that it has developed a dedicated drop test system for board level reliability. The system can be used for BLR drop tests for the testing of solderjoint interconnects using a glitch detection system.

Further to the BLR drop tests MASER Engineering is offering BLR TC and BLR Bending tests.

The excisting drop test system can be used for drop tests of devices (hermetic) or systems.

For any further information please contact Mr. Wilhelm Niessen (Physical Analysis and Reliability Test Department Manager) or Mr. Mark Gortemaker (Sales & Marketing Manager).

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