SemIsrael Expo 2014

13 October 2014

MASER Engineering will be present at the SemIsrael Expo 2014 event held on November 24, 2014 held in Avenue Convention Center, located in the Airport City, Tel Aviv in Israel. 

Mr. Kees Revenberg (MD) will give a presentation about "2D and 3D Non Destructive Analysis for advanced semiconductor packages". The presentation is about new Non Destructive Analysis (NDA) techniques in the first level F/A flow. With unclear defect locations F/A engineers prefer to start with NDA steps avoiding removal or interfering with the root cause defects.
MASER Engineering will present its NDA flow with Electrical, XRAY, SAM, LIT and EOTPR analysis capabilities. The latter technique, Electro-Optical TeraHertz Pulse Reflectometry (EOTPR), is our latest addition, dedicated to the localization of open tracks in complex IC packages. The first results look very promising in finding defect locations in the 3D package assemblies.
After an update of modern IC package assembly complexity, each of the five analysis steps will be shown with real application examples.

You are also invited to visit our booth, were you can meet with Mr. Kees Revenberg and Mr. Shachar Bard from MICL, the MASER Engineering representative in Israel.

SemIsrael Expo 2014 - About

SemIsrael Expo 2014 is the #1 Professional Semiconductor Event in Israel.

The event brings together hundreds of Israeli semiconductor professionals from all fields and aspects of the semiconductor industry.
The Expo will host some 1,000 semiconductor professionals from all the Israeli semiconductor community; local fabless & startups, local R&D offices of multinationals and IDMs, foundries, design houses, labs and universities.

Participation in all Expo parts (booths area, technical tracks) is free, but requires early registration and approval.
We provide: free entrance, free lunch, and free parking to our guests.

The Expo holds 4 professional tracks that runs in parallel throughout the day:

- IP and Cores (Sponsored by CEVA, in collaboration with D&R)

- Front-end & Verification (Sponsored by Cadence)

- Physical Design (Sponsored by Mentor Graphics)

- Post Silicon (Sponsored by Amkor Technology)

In addition, a 40-booths exhibition area  - where IP, tools, and services will be introduced.