Spring 2013: ChipEx, Electronics & Automation and GSA Executive Forum

15 March 2013

MASER Engineering will be present with a booth or a table top stand at various events the coming months:

  • ChipEx2013 conference, April 30 - May 1, Tel Aviv (Israel).
  • Electronics & Automation exhibition, May 28-30, Utrecht (The Netherlands).
  • GSA Executive Forum, June 5-6, Munich (Germany).

MASER Engineering is looking forward to meet you at one of these events!



ChipEx2013, the leading international event of the Israeli microelectronics industry, will be held between April 30 to May 1, 2013 at the David Intercontinental Tel Aviv Convention Center in Tel Aviv, Israel. This year's professional industry event themed “Improved productivity” is produced by ExPlace in cooperation with the SIA, Semiconductor Industry Association, and Gary Smith EDA.  The goal of the conference is to update all professionals involved with the Israeli microelectronics industry with the latest technological innovations and the future direction of the industry.

ChipEx2013 target audience are people involved with the microelectronics industry including engineers, R&D managers, senior executives, CEOs of fabless microelectronics companies, multinational design centers, consultants, experts, venture capital managers involved with the microelectronics industry as well as electrical/electronics/computers students & professors from the various universities around Israel.

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Electronics & Automation 2013

Electronics & Automation 2013 is the electronica exhibition of the Benelux. This year, the exhibition takes place in the Jaarbeurs Utrecht (The Netherlands), from Tuesday 28 until Thursday 30 May, 2013. The exhibitors give demonstrations and presentations in various seminars on industrial electronics.

MASER Engineering presents itself in the PLOT Reliability Pavilion, together with seven other PLOT members. In the pavilion, the PLOT members show their knowledge and expertise on reliability testing to the public.

Mr. Kees Revenberg, Managing Director of MASER Engineering, will also present a talk on the PLOT Reliability seminar, on Thursday May 30, 2013 (10:15-10:45h, Croesezaal). The title of his presentation is "Reliability Test Plan Development for Electronic Components".
The presentation will give insight in how a Reliability Test plan can be developed for new electronic components. Based on the final application, a program of requirements will be defined for the components, which is then mixed with a FMEA, common practice and RMA experiences. Preferably, standardized test methods are applied in the test plan, to guarantee interlaboratory implementation. In the presentation, a number of examples will be presented from MASER's daily practice with reliability testing.

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GSA Executive Forum 2013

The 2013 GSA European Executive Forum is a two-day event taking place in Munich, Germany. Delegates include GSA’s Board of Directors, GSA’s EMEA Leadership Council, and other VIPs from Europe, Asia and the US. The forum brings C-level executives together from across Europe to network, collaborate and learn from leading experts focused on advancing the EMEA semiconductor industry. The event will spotlight movements influencing the wireless, automotive and energy markets as well as address how Europe can expand its technology presence on the world stage.

A small exhibition will run in parallel to the forum, showcasing supplier and service partners highlighting the latest technology developments. 

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