WAFER FAB PROCESSING course organised by MASER Engineering and Semitracks

07 April 2010

MASER Engineering B.V. and Semitracks Inc. are organizing a 4 day course WAFER FAB PROCESSING from June 14th until 17th 2010.

Wafer Fab Processing offers an in-depth look into the semiconductor manufacturing process, and the individual processing technologies required to make them.

For course details and to register please visit the Semitracks website or use the following link: Wafer Fab processing course.

For any technical questions with respect to the course, please contact Mr. Mark Gortemaker.

Overview

Semiconductor and integrated circuit developments continue to proceed at an incredible pace. The industry as a whole has gotten to this point of incredible complexity through the process of countless breakthroughs and developments in wafer fab processing. Today’s wafer fab contains some of the most complex and intricate procedures ever developed by mankind. Wafer Fab Processing is a 4 day course that offers an in-depth look into the semiconductor manufacturing process, and the individual processing technologies required to make them. We place special emphasis on the basics surrounding each technique, and we delve into the current issues related to manufacturing the next generation devices. This course is a must for every manager, engineer and technician working in the semiconductor industry, using semiconductor components or supplying tools to the industry.

By focusing on the basics of each processing step and the issues surrounding them, participants will learn why certain techniques are preferred over others. Our instructors work hard to explain how semiconductor processing works without delving heavily into the complex physics and mathematical expressions that normally accompany this discipline.

Participants learn basic but powerful aspects about the semiconductor industry. This skill-building series is divided into three segments:

  1. Basic Processing Steps. Each processing step addresses a specific need in IC creation. Participants learn the fundamentals of each processing step and why they are used in the industry today.
  2. The Evolution of Each Processing Step. It is important to understand how wafer fab processing came to the point where it is today. Participants learn how each technique has evolved for use in previous and current generation ICs.
  3. Current Issues in Wafer Fab Processing. Participants learn how many processing steps are increasingly constrained by physics and materials science. They also learn about the impact of using new materials in the fabrication process and how those materials may create problems for the manufacturers in the future