PLOT Showcase 2009

At the PLOT Showcase 2009, which was held on October 14th, 2009, in Leusden, The Netherlands, Mr. Kees Revenberg (Managing Director) of MASER Engineering presented a talk entitled:

Fast bending stress test of solder interconnects

ABSTRACT
Handheld electronic systems, like mobile (smart) phones have a single PCB with high density functional devices. The lead-free solder interconnect have to withstand severe mechanical stress due to accidental drops on different floors. Mobile phone manufacturing companies have put a lot of effort in the investigation of these solder interconnects. These stress tests consist of high impact mechanical shock test, bending test and thermal stress test. This presentation is about the bending test and a new tool to perform about 10 times faster a stress test on board level interconnects. The results of the new tool make bending stress test until failure of large amounts of board bending.

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The presentation is available and can be downloaded here (in pdf).
More information on the PLOT Showcase 2009 can be found here.

For more information on this presentation and the stress test services at MASER Engineering, please contact Mr. Kees Revenberg.


About PLOT
To promote the development of testing products to get to field conditions as functioning as expected by the customer, the Environmental Technology platform (PLOT) is established in 1995. PLOT is an association that is connected to FHI, federation of technology branches and it currently has about forty members. MASER Engineering B.V. is a member of PLOT.

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