ECTC 2013 paper

ECTC 2013 banner2.jpg

At the ECTC 2013, a joint paper between M2i, Dimes Technology Center, Delft University of Technology, Advanced Semiconductor Engineering and MASER Engineering was presented by Mr. Jiaqi Tang. The contribution of MASER Engineering to this paper was provided by Mr. Ewald Reinders (Senior Physical Analysis Engineer) and Mr. Kees Revenberg (Managing Director). The ECTC 2013, the IEEE 63rd Electronics Components and Technology Conference, took place in Las Vegas (NV, USA) on May 28th to 31st, 2013.

ECTC 2013 p1 small.jpg

Microwave Induced Plasma Decapsulation of Stressed and Delaminated High Pin-count Copper Wire Bonded IC Packages

J. Tang [1,2]; C.H. Chen [4]; S.K. Liang [4]; E.G.J. Reinders [5]; C.Th.A. Revenberg [5]; J.B.J. Schelen [3] and C.I.M. Beenakker [2].

  1. Materials innovation institute (M2i)
  2. Laboratory of Electronic Components, Technology and Materials (ECTM)
    Delft Institute of Microsystems and Nanoelectronics (Dimes)
  3. Electronic and Mechanical Support Division (DEMO)
    Delft University of Technology, P.O. Box 5053, 2600 GB, Delft, The Netherlands
  4. Failure Analysis Labs, Advanced Semiconductor Engineering, Inc.,
    26 Chin 3rd Rd., Nantze Export Processing Zone, 811 Nantze, Kaohsiung, Taiwan
  5. MASER Engineering B.V., Capitool 56, 7521 PL, Enschede, The Netherlands

The applicability of Microwave Induced Plasma (MIP) afterglow etching in copper wire bonded IC package decapsulation is investigated. In-situ monitoring of the processing temperature during plasma etching is conducted with SOT23 components with diode devices inside as temperature sensor. Parameters that influence etching temperature and efficient MIP etching process are discussed. Aged epoxies in molding compound encapsulants after thermal stress tend to be more resistant to conventional acid etching. IC packages that went through temperature cycling are decapsulated by MIP etching to evaluate the capability of this technique. High pin-count 18 um palladium coated copper wire bonded BGA package with delamination defects are decapsulated without process-induced damage by MIP afterglow etching and the results are compared with cold acid etched components.

ECTC 2013 paper2.jpg 

The entire paper can be found in the ECTC 2013 symposium proceedings (N/A). More information on the ECTC 2013 can be found here.

For more information on this paper and the microwave induced plasma decapsulation services at MASER Engineering, please contact Mr. Kees Revenberg or Mr. Ewald Reinders.