EPTC 2012 paper

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At the EPTC 2012, a joint paper between M2i, Dimes Technology Center, Delft University of Technology and MASER Engineering was presented by Mr. Jiaqi Tang. The contribution of MASER Engineering to this paper was provided by Mr. Ewald Reinders (Senior Physical Analysis Engineer) and Mr. Kees Revenberg (Managing Director). The EPTC 2012, the IEEE 14th Electronics Packaging Technology Conference, took place in Singapore on December 5th to 7th, 2012.

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Decapsulation of High Pin Count IC Packages with Palladium Coated Copper Wire Bonds using an Atmospheric Pressure Plasma

J. Tang [1,2]; E. G. J. Reinders [4]; C. Th. A. Revenberg [4]; J. B. J. Schelen [3] and C. I. M. Beenakker [2]

  1. Materials Innovation Institute (M2i)
  2. Laboratory of Electronic Components, Technology and Materials (ECTM)
    Delft Institute of Microsystems and Nanoelectronics (Dimes)
  3. Electronic and Mechanical Support Division (DEMO) Delft University of Technology, Delft, The Netherlands.
  4. MASER Engineering B.V., Enschede, The Netherlands.

The applicability of microwave induced plasma based decapsulation technique to high pin count palladium coated copper wire bonded IC packages is studied. One of the major limiting factors that causes low molding compound etching rate by plasma is the SiO2 agglomerate formation during etching. A new process combining Ar/O2 plasma etching with ultrasonic cleaning is developed to safely and efficiently remove the molding compound without causing damage to the die and the copper wire bonds. General plasma etching recipe that can be easily applied to different types of packages is developed. Comparison between plasma and cold acid decapsulation based on the same BGA package with 20 μm palladium coated copper bond wires is made. Plasma removal of the Si3N4 passivation layer is achieved with endpoint detection by real-time imaging of the plasma etching process. It appears that the combination of laser ablation with plasma etching gives a superior performance over laser ablation with cold acid etching.

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The entire paper can be found in the EPTC 2012 symposium proceedings (link). More information on the EPTC 2012 can be found here.

For more information on this paper and the microwave induced plasma based decapsulation technique, please contact Mr. Kees Revenberg or Mr. Ewald Reinders.