ICEPT 2013 paper

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At the ICEPT 2013, a joint paper between M2i, Dimes Technology Center, Delft University of Technology and MASER Engineering was presented by Mr. Jiaqi Tang. The contribution of MASER Engineering to this paper was provided by Mr. Alexander Knobben (BSc student Chemical Engineering), Mr. Ewald Reinders (Senior Physical Analysis Engineer) and Mr. Kees Revenberg (Managing Director). The ICEPT 2013, the 14th International Conference on Electronic Packaging Technology, took place in Dalian (China), on August 11th to 14th, 2013.

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Microwave Induced Plasma Decapsulation of Thermally Stressed Multi-tier Copper Wire Bonded IC Packages

J. Tang [1,2]; A.R.G.W. Knobben [4]; E.G.J. Reinders [4]; C.Th.A. Revenberg [4]; J.B.J. Schelen [3] and C.I.M. Beenakker [2].

  1. Materials innovation institute (M2i)
  2. Laboratory of Electronic Components, Technology and Materials (ECTM)
  3. Electronic and Mechanical Support Division (DEMO)
    Delft Institute of Microsystems and Nanoelectronics (Dimes)
    Delft University of Technology, P.O. Box 5053, 2600 GB, Delft, The Netherlands
  4. MASER Engineering B.V., Capitool 56, 7521 PL, Enschede, The Netherlands

Thermally stressed high-density multi-tier copper wire bonded IC packages are the most challenging tasks in IC package decapsulation. For acid decapsulation, the hardening of epoxy in molding compound after stress tests requires much longer etching duration. As a result, copper bond wires suffer severe corrosion damage compared to un-stressed package counterparts. For plasma decapsulation, the high-density bond wires block the radicals in the plasma to reach the molding compound beneath the wire loops. As a consequence, molding compound residues around the Cu/Al ball bonds become impossible to remove. This work investigates the difficulties when exposing Cu/Al ball bonds in high-density copper wire packages after thermal stress testing, and proposes an improved Microwave Induced Plasma decapsulation process that enables clean exposure of Cu/Al ball bonds while preserving the bond wire surface features.

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Keywords: plasma decapsulation; copper wire; IC package; failure analysis; thermal stress testing

The entire paper can be found in the ICEPT 2013 symposium proceedings (link). More information on the ICEPT 2013 can be found here.

For more information on this paper and the microwave induced plasma decapsulation services at MASER Engineering, please contact Mr. Kees Revenberg or Mr. Ewald Reinders.