IRPS 2013 paper

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At the IRPS 2013, a joint paper between DCG Systems, Sector Technologies and MASER Engineering was presented by Mr. Christian Schmidt. The contribution of MASER Engineering to this paper was provided by Mr. Ewald Reinders (Senior Physical Analysis Engineer). The IRPS 2013, the IEEE International Reliability Physics Symposium, took place in Monterey (California, USA) on April 14th to 18th, 2013.

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Localization of electrical active defects caused by reliability-related failure mechanisms by the application of Lock-in Thermography

Christian Schmidt [1], Kannu Wadhwa [2], Antoine Reverdy [3] and Ewald Reinders [4].

  1. System and Application Development Microelectronics, DCG Systems GmbH, Erlangen, Germany
  2. DCG Systems, Fremont, CA, USA
  3. Sector Technologies SAS, Gieres, France
  4. MASER Engineering B.V., Enschede, The Netherlands


ABSTRACT
The fabrication and development of modern microelectronic devices is strongly influenced by the requirements of reliability. One of the methods to fulfill these requirements is the method of Lock-in Thermography (LIT) which enables a non-destructive fault isolation as well on IC as on package level. As a results, LIT provides a hot spot localization with high spatial resolution and high sensitivity. Within this paper several case studies are presented where.

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Keywords: Lock-in Thermography, non-destructive, hot spot localization, failure analysis, whisker detection, device characterization

The entire paper can be found in the IRPS 2013 symposium proceedings (link). More information on the IRPS 2013 can be found here.

For more information on this paper and the Lock-in Thermography test services at MASER Engineering, please contact Mr. Kees Revenberg or Mr. Ewald Reinders.