ISTFA 2010 paper

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At the ISTFA 2010, a joint paper between DCG Systems and MASER Engineering was presented by Mr. Tahir Malik. The ISTFA 2010, the 36th International Symposium for Testing and Failure Analysis, took place in Addison (Texas, USA) on November 14th to 18th, 2010.

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Novel Circuit Edit Solution for Bulk Copper Milling

Tahir Malik [1], Rajesh Jain [1], Ferdi Meijer [2] and Tim Velthof [2].

  1. DCG Systems Inc., Fremont, CA 94539, USA
  2. MASER Engineering B.V., Enschede, The Netherlands


ABSTRACT
Focused Ion Beam (FIB) circuit edit (CE) has been playing a pivotal role in providing insight to ramp-up yield. Numerous IC fabrication processes inherently pose unique challenges to FIB circuit edit approaches. Copper (Cu) has been the material of choice for interconnects as technology features shrink to the 180 nm node and below. Thick copper planes are used for multiple reasons that are mentioned later. Milling through thick copper planes has been tremendously challenging and time consuming during FIB circuit edits. Proposed is a methodology to enhance the bulk Cu removal process at astounding etching rates while maintaining planarity. 
 

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The entire paper can be found on p. 431 to 439 in the “ISTFA 2010: Proceedings of the 36th International Symposium for Testing and Failure Analysis” conference proceedings, published by ASM International (link). More information on the ISTFA can be found here.

For more information on this paper and the FIB circuit edit services at MASER Engineering, please contact Mr. Kees Revenberg or Mr. Ferdi Meijer.