MASER Engineering participated in the European “RF2THz SiSoC” research project, which is a shortened title of “From RF to MMW and THz Silicon System-on-Chip technologies”.
R2THz SiSoC is funded in the framework of the EUREKA cluster CATRENE, a European public-private partnership focusing on the technology and applications of nano-electronics. In this program, a competent consortium of 31 partners from The Netherlands, France, Germany, Belgium and Luxemburg will work together, consisting of the main European silicon manufacturers, SME’s, research institutes and universities, as well as system integrators.


Duration: 3 years (July 2011 – June 2014).
Project extended with 6 months to December 2014.

Project Overview

The RF2THz SiSoC project aims at the establishment of silicon system-on-chip technology platforms for emerging Radio Frequency (RF), Millimeter-Wave (MMW) and TeraHertz (THz) consumer applications, such as: 77GHz/120GHz automotive radars, MMW imaging and sensing, fast measurement equipment, 60GHz wireless networking and fast downloading Rx/Tx, 400Gbit/s optical data communications, 4G photonic mobile communication transceiver and RF wireless communication requiring high performance devices (transmitted power, consumption, integration, isolation), as well as two-way satellite communication systems. Moreover it targets at the creation of a platform for various MMW and THz applications from different disciplines like health science, material science, genetic screening, security, industrial automation.

More detailed information on the project can be found in the profile here.

Contribution MASER Engineering

In RF2THz SiSoC, MASER Engineering will study the reliability aspects of the new two-way satellite communication systems, including the accelerated life test setup, ESD handling requirements and package/device failure analysis. Within the program, MASER Engineering will closely cooperate with several other consortium members, like NXP Semiconductors NL, Salland Engineering, Bruco, Axiom-IC Twente, TU Delft, TU Eindhoven, NEWTEC and ASTRA SES.

Project Consortium

  • Advanced System Technology and User Services (ASTUS), France (link).
  • Alcatel-Lucent, Germany (link).
  • Agilent Technologies, Germany (link).
  • ASTRA SES, Luxembourg (link).
  • AXIOM IC Twente, The Netherlands (link).
  • BOSCH, Germany (link).
  • Bruco, The Netherlands (link).
  • Commissariat à l’énergie atomique et aux energies alternatives – Laboratory for Electronics & Information Technology (CEA-Leti), France (link).
  • Delft University of Technology – Electronics Research Laboratory (TU Delft), The Netherlands (link).
  • l’École de l’Innovation Technologique (ESIEE) Paris, France (link).
  • École Nationale Supérieure d’Ingénieurs de Caen (ENSICAEN), France (link).
  • Eindhoven University of Technology (TU/e), The Netherlands (link).
  • Fraunhofer Gesellschaft – Institut für Integrierte Schaltungen / Entwerfsautomatisiering (FhG IIS/EAS), Germany (link).
  • Grenoble Institute of Technology (G-INP) – Institut de Microélectronique Electromagnétisme et Photonique and LAboratoire d'Hyperfréquences et de Caractérisation (IMEP-LAHC), France (link).
  • IHP - Innovations for High Performance Microelectronics, Germany (link).
  • Institut d’Electronique, de Microélectronique, et de Nanotechnologie (IEMN), France (link).
  • Institut d’Electronique du Sud (IES), France (link).
  • Laboratoire de l’Intégration du Matériaux au Système (IMS), France (link).
  • MASER Engineering, The Netherlands (link).
  • Micram, Germany (link).
  • NEWTEC, Belgium (link).
  • NXP Semiconductors, The Netherlands (link).
  • NXP Semiconductors, France (link).
  • Salland Engineering, The Netherlands (link).
  • Silicon Radar, Germany (link).
  • ST Microelectronics (ST-Fr / ST-Cr2), France (link).
  • SynView, Germany (link).
  • Technische Universität Berlin (TU Berlin), Germany (link).
  • Technische Universität Dresden (TU Dresden) – Institut für Grundlagen der Elektrotechnik und Elektronik, Germany (link).
  • Telecom Bretagne, France (link).
  • Universität des Saarlandes – Elektronik und Schaltungstechnik (UdS-EuS), Germany (link).
  • XMOD Technologies, France (link).

RF2THz SiSoC-all-small.jpg


Project information

  • Project profile on CATRENE call CT209 (link).
  • RF2THz SiSoC description on Bundesministerium für Bildung und Forschung (link).
  • Open Bipolar Workshop (Bordeaux, France), organized by RF2THz SiSoC and DOT7 [03-10-2013] (link). 


  • Article "A 56.4-to-63.4 GHz multi-rate all-digital fractional-N PLL for FMCW radar applications in 65 nm CMOS" in IEEE Journal of Solid-State Circuits 46-5 (2014) 1081-1096 by TU Delft (link).
  • Presentation "Application scenarios from RF2THz SiSoC" on Open Bipolar Workshop (Bordeaux, France) by Alcatel-Lucent [03-10-2013] (link).
  • Presentation "Passive integration and packaging for mm-wave applications" on Open Bipolar Workshop (Bordeaux, France) by NXP Semiconductors [03-10-2013] (link).
  • Presentation "Building blocks and system architecture for mm-wave imaging radar" on Open Bipolar Workshop (Bordeaux, France) by Delft University of Technology [03-10-2013] (link).
  • Presentation "A 55-nm BiCMOS platform for optical and miilimeter-wave systems-on-chip" on Open Bipolar Workshop (Bordeaux, France) by STMicroelectronics [03-10-2013] (link).
  • Presentation "BiCMOS integration of photonic components" on Open Bipolar Workshop (Bordeaux, France) by IHP [03-10-2013] (link).
  • Presentation "Electro-thermal characterization and modelling" on Open Bipolar Workshop (Bordeaux, France) by IMS / University of Bordeaux [03-10-2013] (link).
  • Article "Impact of back-end-of-line on thermal impedance of SiGe HBTs" on SISPAD 2013 (Glasgow, Scotland) by IMS / University of Bordeaux [06-2013] (link).
  • Article "Characterization of intra device mutual thermal coupling in multi finger SiGe:C HBTs" on EDSSC 2013 (Hong Kong, China) by XMOD Technologies [03-06-2013] (link).
  • Presentation "B5T model status, issues, scaling" on 13th HICUM workshop (Delft, The Netherlands) by TU Dresden [27-05-2013] (link).
  • Presentation "CMOS/BiCMOS circuit technologies for millimetre-wave wireless systems incorporating on-chip magnetics" on ESSDERC 2012 RF workshop (Bordeaux, France) by TU Delft [21-09-2012] (link).
  • Poster with project overview (limited accessibility).

Press releases

  • Press release Silicon Radar [2012] (link).
  • Press release MASER Engineering [21-12-2011] (link).
  • News release Salland Engineering [06-01-2012] (link).


CATRENE     Agentschap NL