Failure Analysis

  • Non-destructive testing
  • Electrical parameter / structural analysis
  • Mechanical probing
  • FIB/SEM dual beam preparation / imaging
  • Laser assisted fault localization / OBIRCH
  • CCD / InGaAs Photon Emission Microscopy (PEM)
  • Absolute / Lock-In Thermography (LIT)
  • Atomic Force Microscopy (AFM)
  • Electro Optical Terahertz Pulse Reflectometry (EOTPR)

Failure analysis on electronic components is a continuous challenging task. The smaller transistor dimensions, increasing functional complexity and changing device packaging styles requires new tools and skills for sample preparation, fault localization techniques, high resolution imaging and analysis.

MASER Engineering is offering a wide range of preparation tools, electrical, thermal and physical fault localization systems, optical, electron and ion microscopy to analyze the failing component.

The results of this process are exchanged over our secure web link between our customer and our F/A engineers.

For RMA (return merchandise authorization), the so called field returns, MASER Engineering has a complete analysis flow available with knowledgeable Engineers and Technicians to support the customer in finding the rootcause.

 

Downloads:

  • here the failure analysis service leaflet
  • here the dynamic failure analysis service leaflet
  • here the PEM / OBIRCH Analysis service leaflet
  • here the Lock-In Thermography service leaflet
  • here the EOTPR service leaflet
  • here the AFM service leaflet