Mechanical Test Service

  • Sine vibration
  • Random vibration
  • Combined vibration / Temperature cycling
  • Half sine bump and shock
  • Board level bending and shock
  • IP classification
  • Dimensions and mass measurements
  • Wire and solderball pull / shear test


A wide range of mechanical stress applications or measurements can be executed by MASER Engineering.

The mechanical properties of an electronic system enclosure have to be stressed in order to determine the robustness of the total system. The multiple electrical interconnections have our special attention.

MASER Engineering operates an Electro Dynamic Shaker for the execution of vibration, bump and low g-force shock tests on components and systems. Sine and random vibration can be applied in 3 directions.

For high g-force shock and BLR drop test 2 systems are available for component shock and board level reliability solderjoint drop test.

The classic vibration and shock test is used to test the robustness of a complete system using IEC/MIL specifications.



  • here the Board Level Reliability test service leaflet 
  • here the System Level Reliability test service leaflet
  • here the Enclosure test (IP) service leaflet